Package for semiconductor device including guide rings and manufacturing method of the same

ABSTRACT

An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional patent application is a divisional of U.S.patent application Ser. No. 13/188,069, filed on Jul. 21, 2011, whichclaims priority under 35 USC§119 to Korean Patent Application No.10-2010-0094617, filed on Sep. 29, 2010, the contents of which isincorporated herein in its entirety by reference.

BACKGROUND

Example embodiments of the inventive concepts described herein generallyrelate to semiconductor packages and manufacturing methods of the sameand, more particularly, to a semiconductor package capable of mounting aplurality of integrated circuits and manufacturing methods of the same.

In recent years, wafer-level chip size packages have become a popularpackaging technology. In a wafer-level chip size package, integratedcircuit chips (IC chips) are mounted on a substrate in a so-called ‘flipchip’ manner. A semiconductor package allows a plurality of iC chips tobe stacked sequentially.

SUMMARY

Example embodiments of the inventive concepts relate to semiconductorpackages and manufacturing methods of the same.

According to example embodiments of the inventive concepts, asemiconductor package may include a first substrate including a firstpad, a second substrate upwardly spaced apart from the first substrateand including a second pad opposite to the first pad, at least oneelectrode coupled between the first pad and the second pad, and a guidering formed at a periphery of the electrode between the first substrateand the second substrate.

The guide ring of the semiconductor package may be configured to conformto a shape of the periphery of the electrode.

The guide ring of the semiconductor package may be arranged between theelectrode and an adjacent electrode so the guide ring is configured toprevent an electrical short between the electrode and the adjacentelectrode.

The guide ring of the semiconductor package may include a top surfaceand a bottom surface. The top surface of the guide ring may be connectedto the second substrate, and the bottom surface of the guide ring may beconnected to the first substrate.

The guide ring of the semiconductor package may include a tubesurrounding the electrode. The tube may be configured to conform to acircumference of the electrode. At least one solder ball may be arrangedwithin the guide ring. The guide ring may also be arranged between theelectrode and an adjacent electrode so the guide ring is configured toprevent an electrical short between the electrode and the adjacentelectrode.

The guide ring of the semiconductor package may include at least onepillar configured to conform to a circumference of the electrode. Atleast one solder ball may be arranged within the guide ring. The guidering may also be arranged between the electrode and an adjacentelectrode so the guide ring is configured to prevent an electrical shortbetween the electrode and the adjacent electrode.

The guide ring of the semiconductor package may include at least fourpillars, each pillar is positioned at a different corner of a four-sidedperimeter surrounding the electrode. The guide ring may further includea top surface and a bottom surface, and the top surface of the guidering may be connected to the second substrate, and the bottom surface ofthe guide ring may be connected to the first substrate.

The guide ring may contain a dielectric material or a high-molecularcompound.

The first substrate of the semiconductor package may further include afirst photo solder resist configured to support the guide ring, and thesecond substrate of the semiconductor package may further include asecond photo solder resist configured to support the guide ring.

According to example embodiments of the inventive concepts, asemiconductor package may include a first substrate including a firstpad, a second substrate upwardly spaced apart from the first substrateand including a second pad opposite to the first pad, at least oneelectrode coupled between the first pad and the second pad, and a guidering formed at a periphery of the electrode between the first substrateand the second substrate. The guide ring of the semiconductor packagemay be configured to conform to a shape of the periphery of theelectrode. The guide ring of the semiconductor package may be arrangedbetween the electrode and an adjacent electrode so the guide ring isconfigured to prevent an electrical short between the electrode and theadjacent electrode.

The guide ring of the semiconductor package may include a tubesurrounding the electrode.

The guide ring of the semiconductor package may include a plurality ofpillars configured to conform to a circumference of the electrode. Theelectrode may be arranged inside the plurality of pillars.

The guide ring of the semiconductor package may include a top surfaceand a bottom surface. The top surface of the guide ring may be connectedto the second substrate, and the bottom surface of the guide ring may beconnected to the first substrate.

According to example embodiments of the inventive concepts, asemiconductor package may include a first substrate including a firstpad, a second substrate upwardly spaced apart from the first substrateand including a second pad opposite to the first pad, at least oneelectrode coupled between the first pad and the second pad, and a guidering formed at a periphery of the electrode between the first substrateand the second substrate. The guide ring of the semiconductor packagemay include a top surface and a bottom surface. The top surface of theguide ring may be connected to the second substrate, and the bottomsurface of the guide ring may be connected to the first substrate.

The guide ring of the semiconductor package may include at least fourpillars, each pillar is positioned at a different corner of a four-sidedperimeter surrounding the electrode.

Example embodiments of the inventive concepts relate to a manufacturingmethod of a semiconductor package, including providing a first substrateincluding a first pad, providing a second substrate including a secondpad opposite to the first pad, forming a guide ring to surround one ofthe first pad and the second pad on at least one of the first and secondsubstrates, forming at least one electrode on one of the first pad andthe second pad, and bonding the first substrate and the second substrateto each other to connect the first pad and the second pad to theelectrode.

Forming a guide ring may include one of a dispensing, printing and aphotolithography process.

Providing the first substrate may include forming the first pad on thefirst substrate, forming a first photo solder resist on the entiresurface of the first substrate including the first pad, and removing thefirst photo solder resist on the first pad to expose the first pad.

The forming the at least one electrode may include forming a firstelectrode on the first pad and forming a second electrode on the secondpad.

The guide ring may align the first electrode or the second electrodewhen the first substrate and the second substrate are bonded to eachother.

The guide ring may be formed on the first photo solder resist at acircumference of the first pad.

The second substrate may further include a second photo solder resist toselectively expose the first pad. The manufacturing method may furtherinclude heating the guide ring to be bonded to the first and secondphoto solder resists after bonding the first substrate and the secondsubstrate to each other.

The providing of the first substrate may include forming a first photosolder resist on the first substrate, aligning the first pad on thefirst photo solder resist, and melt-bonding the first pad onto the firstsubstrate. The melt-bonding of the first pad may include heating thefirst substrate.

The manufacturing method may further include forming a first integratedcircuit chip on the first substrate after forming the guide ring.

According to example embodiments of the inventive concepts, themanufacturing method of a semiconductor package may include providing afirst substrate including an electrode pad and a bump pad, forming aguide ring on the first substrate at the circumference of the electrodepad, forming a first integrated circuit chip on the bump pad, andbonding a second substrate, where an electrode is formed to be oppositeto the electrode pad, onto the first substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments of the inventive concepts will become more apparentin view of the attached drawings and accompanying detailed description.The example embodiments depicted therein are provided by way of example,not by way of limitation, wherein like reference numerals refer to thesame elements. The drawings are not necessarily to scale, emphasisinstead being placed upon illustrating aspects of example embodiments ofthe inventive concepts.

FIG. 1A is a top plan view illustrating a semiconductor packageaccording to example embodiments of the inventive concepts.

FIG. 1B is a cross-sectional view taken along the line I-I′ in FIG. 1A.

FIGS. 2 to 3 are top plan views specifically illustrating a guide ringshown in FIG. 1A.

FIGS. 4A, 4B, and 4C are top plan views illustrating alternativearrangements of the guide ring according to example embodiments of theinventive concepts.

FIGS. 5A to 12B, are process top plan views and process cross-sectionalviews illustrating a manufacturing method of a semiconductor packageaccording to example embodiments of the inventive concepts,respectively.

DETAILED DESCRIPTION

Example embodiments of the inventive concepts will now be described morefully hereinafter with reference to the accompanying drawings, in whichexample embodiments of the inventive concepts are shown. It should benoted, however, that example embodiments of the inventive concepts aremay be embodied in many different forms and should not be construed asbeing limited to the embodiments set forth herein; rather, these exampleembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the concept of the example embodimentsto those of ordinary skill in the art. In the drawings, the thicknessesof layers and regions are exaggerated for clarity. Like referencenumerals in the drawings denote like elements, and thus theirdescription will be omitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Like numbers indicate like elementsthroughout. As used herein the term “and/or” includes any and allcombinations of one or more of the associated listed items. Other wordsused to describe the relationship between elements or layers should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon”).

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises”, “comprising”, “includes” and/or “including,” if usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, example embodiments should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, an implanted region illustrated as arectangle may have rounded or curved features and/or a gradient ofimplant concentration at its edges rather than a binary change fromimplanted to non-implanted region Likewise, a buried region formed byimplantation may result in some implantation in the region between theburied region and the surface through which the implantation takesplace. Thus, the regions illustrated in the figures are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to limit the scope ofexample embodiments.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, such as those defined incommonly-used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

FIG. 1A is a top plan view illustrating a semiconductor packageaccording to example embodiments of the inventive concepts, and FIG. 1Bis a cross-sectional view taken along the line I-I′ in FIG. IA. FIGS. 2to 4 are top plan views illustrating a guide ring shown in FIG. 1A.

Referring to FIGS. 1A to 3, a semiconductor package according to exampleembodiments of the inventive concepts may include guide rings 30 (or30′) formed at the peripheries (for example, circumferences) of firstupper solder balls 46 and second lower solder balls 86 between a firstsubstrate 10 and a second substrate 50. The first upper solder balls 46and the second lower solder balls 86 may electrically connect firstupper ball pads 20 of the first substrate 10 to second lower ball pads60 of the second substrate 50. The guide rings 30 may surround the firstupper solder balls 46 and the second lower solder balls 86.

A guide ring 30 (or 30′) may be arranged between a pair of a first uppersolder ball 46 coupled to a second lower solder ball 86, and an adjacentpair of a first upper solder ball 46 coupled to a second lower solderball 86. As such, a guide ring 30 (or 30′) may minimize a pair firstupper solder ball 46 coupled to a second lower solder ball 86 fromcontacting an adjacent pair of a first upper solder ball 46 coupled to asecond lower solder ball 86. Thus, the semiconductor package may reduceshort-circuit of the first upper solder balls 46 and the second lowersolder balls 86 between the first substrate 10 and the second substrate50.

Each of the first and second substrates 10 and 50 may include a printedcircuit board (PCB). The first substrate 10 and the second substrate 50may mount at least one first integrated circuit chip 40 and at least onesecond integrated circuit chip 80 thereon, respectively. The firstintegrated circuit chip 40 may be fixed to the first substrate 10 byfirst bumps 42 and a first encapsulation resin 44. The first bumps 42may be bonded to first bump pads 22 on the first substrate 10.Similarly, the second integrated circuit chip 80 may be fixed to thesecond substrate 50 by second bumps 82 and a second encapsulation resin84. The second bumps 82 may be bonded second bump pads 62 on the secondsubstrate 50.

The first substrate 10 may include a first main frame 12, first bumppads 22 formed on the center of the first main frame 12, first upperball pads 20 formed on the edge of the first main frame 12 along outercircumferences of the first bump pads 22, first lower ball pads 18formed beneath the first main frame 12, and first upper and lower photosolder resists 24 and 26 formed on and beneath the first main frame 12to selectively expose the first upper and lower ball pads 20 and 18 andthe first bump pads 22. While FIG. 1B shows the first bump pads 22formed on the center of the first main frame 12 and first upper ballpads 20 formed on the edge of the first main frame 12, exampleembodiments are not limited thereto.

The first bump pads 22 and the first upper balls pads 20 may beinsulated by the first upper photo solder resist 24. The first bump pads22 and the first upper ball pads 20 may be electrically connected by afirst wire 14 on the first main frame 12. The first upper photo solderresist 24 may be arranged on the first wire 14. The first wire 14 mayalso be arranged inside or beneath the first main frame 12. The firstupper and lower ball pads 20 and 18 may be connected to a firstthrough-electrode 16 formed in the main frame 12. The firstthrough-electrode 16 may electrically connect the first bump pads 22 tothe first lower ball pads 18. The first lower ball pads 18 may be bondedto a first lower solder ball 48. The first upper ball pads 20 may bebonded to the first upper solder ball 46. The guide ring 30 (or 30′) maybe arranged at the periphery (for example, circumference) of the firstupper solder ball 46. The guide ring 30 (or 30′) may be arranged on thefirst upper photo solder resist 24.

The second substrate 50 may include a second main frame 52, second bumppads 62 formed on the second main frame 52, a second lower ball pad 60formed beneath the second main frame 52, and second upper and photosolder resists 64 and 66 formed on and beneath the second main frame 52to selectively expose the second bump pads 62 and the second lower ballpads 60.

The second bump pads 62 and the second lower ball pads 60 may beelectrically connected to a second through-electrode 56 formed in thesecond main frame 52 by a second wire 54. While FIG. 1B illustrates thesecond through-electrode 56 perpendicularly passing through the insideof the second main frame 52, example embodiments are not limitedthereto. The second through-electrode 56 may be connected to at leastone of the second bump pads 61 and the second lower ball pad 60. Thesecond through-electrode 56 may be connected to the second wire 54. Thesecond wire 54 may be arranged inside the second frame 52. The secondwire 54 may also be arranged on top and bottom surfaces of the secondmain frame 52. A second lower solder ball 86 may be arranged beneath thesecond lower ball pad 60.

The second lower solder ball 86 may be connected to the first uppersolder ball 46. The first upper solder ball 46 and the second lowersolder ball 86 may be arranged in a direction orthogonal to the firstsubstrate 10 and the second substrate 50. The first upper solder ball 46and the second lower solder ball 86 may serve as an electrode connectingthe first substrate 10 to the second substrate 50. The first uppersolder ball 46 and the second lower solder ball 86 may have the samesize. The first upper solder ball 46 and the second lower solder ball 86may each be smaller in diameter than each of the guide rings 30 (or30′).

The guide ring 30 (or 30′) may surround the first upper solder balls 46and the second lower solder balls 86. For example, the guide ring 30 (or30′) may contain a dielectric material or a high-molecular compound toinsulate the first upper solder balls 46 and the second lower solderballs 86. The high-molecular compound may be a high molecular weightpolymer, but example embodiments are not limited thereto. The guide ring30 (or 30′) may have a tube or pillar shape, but example embodiments arenot limited thereto.

FIG. 2 illustrates a guide ring 30 including a tube shape. A tube-shapedguide ring 30 may be a guide ring 30 in which the first upper solderballs 46 and the second lower solder balls 86 are arranged within theguide ring 30 so the guide ring 30 is aligned with the first upper ballpad 20. The guide ring 30 including a tube shape may conform to acircumference of the first upper solder ball 46 coupled to the secondlower solder ball 86 arranged within the guide ring 30.

FIG. 3 illustrates a guide ring 30′ having a pillar shape. Apillar-shaped guide ring 30′ may include a plurality of pillars arrangedalong the peripheries (e.g., circumferences) of the first upper solderballs 46 and the second lower solder balls 86. A pillar-shaped guidering 30′ may be aligned with the first upper ball pad 20. Thepillar-shaped guide ring 30′ may include a plurality of pillars that areconfigured to conform to a circumference of the first upper solder ball46 coupled to the second lower solder ball 86 arranged within the guidering 30′.

Alternatively, as shown in FIG. 4A, pillar-shaped guide rings 30″ may bealternately arranged with the first upper solder balls 46 and the secondlower solder balls 86, between the first substrate 10 and the secondsubstrate 50, so pillar-shaped guide rings 30″ are not aligned with thefirst upper ball pads 20. The pillar-shaped guide rings 30″ are the sameas (or substantially the same as) the guide rings 30 and 30′ illustratedin FIGS. 2 and 3, except the pillar-shaped guide rings 30″ arealternately arranged with the first upper solder balls 46 and the secondlower solder balls 86. FIG. 4A illustrates a four-sided perimeter Psurrounding a first upper ball pad 20. As shown in FIG. 4A, thepillar-shaped guide rings 30″ may include at least four pillars, witheach pillar positioned at a different corner of the four-sided perimeterP surrounding the upper ball pad 20; however, example embodiments arenot limited to the configuration of pillar-shaped guide rings 30″illustrated in FIG. 4A.

While FIG. 4A illustrates four pillars 30″ positioned at the corners ofa four-sided perimeter surrounding the upper ball pad 20, exampleembodiments are not limited thereto. According to example embodiments,more than four pillars 30″ or fewer than four pillars 30″ may surroundthe first upper solder balls 46 and the second lower solder balls 86,and more than four pillars 30″ or fewer than four pillars 30″ may bepositioned at the corners of a perimeter with greater or fewer than foursides surrounding the upper ball pad 20. For example, as shown in FIG.4B, example embodiments may include three pillars 30′″ positioned at thecorners of a three-sided perimeter P′ surrounding the upper ball pad 20.Alternatively, as shown in FIG. 4C, example embodiments may include fivepillars 30″″ positioned at the corners of a six-sided perimeter P″surrounding the upper ball pad 20. In addition, FIG. 4C illustrates thatthe guide ring 30″″ conforms better to the shape of a circumference ofthe upper ball pads 20, and/or first upper solder balls 46 coupled tosecond lower solder balls 86 (not shown in FIG. 4C), as the perimeter P″increases from a four-sided perimeter Pin FIG. 4A to a five-sidedperimeter P″ in FIG. 4C.

The guide rings 30 (or 30′ or 30″ or 30′″ or 30″″) may serve as a spacermaking a distance between the first substrate 10 and the secondsubstrate 20. The guide rings 30 (or 30′ or 30″ or 30′″ or 30″″) may fixthe first substrate 10 and the second substrate 50. The guide rings 30(or 30′ or 30″ or 30″′ or 30″″) may be smaller in height than the firstupper solder balls 46 and the second lower solder balls 86. The guiderings 30 (or 30′) may allow the first upper solder balls 46 and thesecond lower solder balls 86 to be aligned between the first substrate10 and the second substrate 50. The guide rings 30 (or 30′) may protectthe first upper solder balls 46 and the second lower solder balls 86.The guide rings 30 (or 30′) may prevent short-circuit of the firstsolder balls 46 and the second lower solder balls 80. The guide rings 30(30′ or 30″ or 30′″ or 30″″) may replace conventional resins filling aspace between the first substrate 10 and the second substrate 50. Thus,a semiconductor package according to example embodiments of theinventive concepts may increase productivity and production yield.

Now, a manufacturing method of a semiconductor package according toexample embodiments of the inventive concepts will be described below indetail.

FIGS. SA to 11C, and 12A to 12B, are process top plan views and processcross-sectional views illustrating a manufacturing method of asemiconductor package according to example embodiments of the inventiveconcepts, respectively. Package processes for a first substrate 10 and asecond substrate 50 may be performed in a similar manner. For thisreason, the manufacturing method will be described mainly with referenceto process top plan views of the first substrate 10, and process topplan views until bonding the second substrate 50 to the first substrate10 may be omitted. For example, FIG. SA is a top plan view of the firstsubstrate 10 which illustrates a manufacturing method of a semiconductorpackage according to example embodiments of the inventive concept, FIG.5B is a cross-sectional view of the second substrate 50 which is takenalong the line V-V′ in FIG. SA, and FIG. 5C is a cross-sectional view ofthe first substrate 10 which is taken along the line V-V′ in FIG. SA.

Referring to FIGS. SA and 5C, a first main frame 12 may be providedwhere first upper ball pads 20, first lower ball pads 18, first bumppads 22, first through-′electrodes 16, and first wires 14 are formed.The first main frame 12 may include an insulating substrate. The firstupper ball pads 20, the first lower ball pads 18, the first bump pads22, the first through-electrodes 16, and the first wires 14 may containan electrically conductive metal. The first bump pads 22 may be arrangedat the center of the first main frame 12, and the first upper ball pads20 and the first lower ball pads 18 may be arranged on the edge of thefirst main frame 12, although example embodiments are not limitedthereto. While FIG. 5C illustrates the first through-electrodes 16 maybe perpendicularly arranged inside the first main frame 12, exampleembodiments are not limited thereto.

Referring to FIG. 5B, a second main frame 52 may be provided where firstlower ball pads 60, second bump pads 62, second through-electrodes 56,and second wires 54 are formed. The second main frame 52 may include aninsulating substrate. Similarly, the first lower ball pads 60, thesecond bump pads 62, the second through-electrodes 56, and the secondwires 54 may contain an electrically conductive metal. The second bumppads 62 may be arranged at the center of the second substrate 50 and thesecond lower ball pads 60 may be arranged on the lower edge of thesecond substrate 50, although example embodiments are not limitedthereto. While FIG. 5B illustrates the second through-electrode 56perpendicularly arranged through the second main frame 52, exampleembodiments are not limited thereto.

Referring to FIGS. 6A to 6C, FIG. 6A a top plan view of the firstsubstrate 10, FIG. 6B is a cross-sectional view of the second substrate50, which is taken along the line VI-VI′ in FIG. 6A, and FIG. 6C is across-sectional view of the first substrate 10 which is taken along theline VI-VI′ in FIG. 6A. FIGS. 6A and 6C illustrate first upper and lowerphoto solder resists 24 and 26 may be formed upper and lower entiresurfaces of the first main frame 12, respectively. The first upper photosolder resist 24 may be formed on the first upper ball pads 20, thefirst bump pads 22, and the first wires 14. The first lower photo solderresist 26 may cover the first lower ball pads 18. For example, the firstupper and lower solder ball resists 24 and 26 may be formed by means ofa dipping (or alternatively a coating) method.

Referring to FIG. 6B, second upper and lower photo solder resists 64 and66 may be formed on upper and lower entire surfaces (or alternativelypartial surfaces) of the second main frame 52, respectively. The secondupper photo solder resist 64 may be formed on the second bump pads 62.The second lower photo solder resist 66 may cover the second lower ballpad 60.

Referring to FIGS. 7A to 7C, FIG. 7A a top plan view of the firstsubstrate 10, FIG. 7B is a cross-sectional view of the second substrate50 which is taken along the line VII-VII′ in FIG. 7A, and FIG. 7C is across-sectional view of the first substrate 10 which is taken along theline VII-VII′ in FIG. 7A. FIG. 7C illustrates the first upper and lowerphoto solder resists 24 and 26 may be patterned, for example by aphotolithography method or other suitable patterning method. Thepatterns of first upper and lower photo solder resists 24 and 26 mayexpose the first upper ball pads 20, the first bump pads 22, and thefirst lower ball pads 18. The first upper photo solder resist 24 mayprotect the first wire 14.

Referring to FIG. 7B, the second upper and lower photo solder resists 64and 66 may be patterned to selectively expose the second lower ball pads60 and the second bump pads 62. Thereafter, a metal thin film (notshown) may be formed on the first bump pads 22, the first upper andlower pads 20 and 18, the second bump pads 62, and the second lower ballpads 60.

Although not shown, the first upper photo solder resist 24 may be formedprior to formation of the first upper ball pads 20 and the first bumppads 22. The first upper photo solder resist 24 may be formed on themain frame 12. Next, the first upper ball pads 20 and the first bumppads 22 may be aligned on the first upper photo solder resist 24. Next,the first substrate 10 may be heated to melt-bond the first upper ballpads 20 to the second main frame 20.

Referring to FIGS. 8A to 8C, FIG. 8A a top plan view of the firstsubstrate 10, FIG. 8B is a cross-sectional view of the second substrate50 which is taken along the line VIII-VIII′ in FIG. 8A, and FIG. 8C is across-sectional view of the first substrate 10 which is taken along theline VIII-VIII′ in FIG. 8A. FIGS. 8A and 8C illustrate a plurality ofguide rings 30 (or 30′) may be formed on the first upper photo solderresists 24 at the peripheries (e.g., circumferences) of the first upperball pads 20. For example, the guide rings 30 (or 30′) may be formed bymeans of at least one of dispensing, printing, and photolithographymethods; however, example embodiments are not limited thereto. The guiderings 30 (or 30′) may protrude on the first upper photo solder resists24 to have a desired (or alternatively predetermined) height. The firstupper ball pads 20 may be selectively exposed in the guide rings 30 (or30′).

Referring to FIGS. 7B to 8B, the second substrate 50 may be continued tothe next process during the formation of the guide rings 30 (or 30′) ofthe first substrate 10 without adding any process. Although not shown,guide rings 30 (or 30′) alternatively may be formed at the peripheries(e.g., circumferences) of the second lower ball pads 60 of the secondsubstrate 50 when the guide rings 30 (or 30′) are not formed on thefirst substrate 10.

Referring to FIGS. 9A and 9C, FIG. 9A a top plan view of the firstsubstrate 10, FIG. 9B is a cross-sectional view of the second substrate50 which is taken along the line IX-IX′ in FIG. 9A, and FIG. 9C is across-sectional view of the first substrate 10 which is taken along theline IX-IX′ in FIG. 9A. FIGS. 9A and 9C illustrate first bumps 42 and atleast one first integrated circuit chip 40 may be formed on the firstbump pads 22, and first lower solder balls 48 may be bonded to the firstlower ball pads 18. The first integrated circuit chip 40 may be alignedon the first substrate 10. The first integrated circuit chip 40 may bebonded to the first substrate 10 by the first bumps 42. The firstintegrated circuit chip 40 and the first substrate 10 may compress thefirst bumps 42 due to an external force. The first bumps 42 mayestablish an electrical connection between the first integrated circuitchip 40 and the first bump pads 22. Although not shown, the firstintegrated circuit chip 40 may be wire-bonded or TAB-bonded to the firstsubstrate 10.

Referring to FIG. 9B, second bumps 82 and at least one second integratedcircuit chip 80 may be formed on the second bump pads 62. The secondintegrated circuit chip 80 and the second bumps 82 may be aligned on thesecond substrate 50. The second integrated circuit chip 80 may bewire-bonded or TAB-bonded to the second substrate 50.

Referring to FIGS. 1OA to IOC, FIG. 1OA a top plan view of the firstsubstrate 10, FIG. 1OB is a cross-sectional view of the second substrate50 which is taken along the line X-X′ in FIG. 1OA, and FIG. 1OC is across-sectional view of the first substrate 10 which is taken along theline X-X′ in FIG. 10. FIGS. 1OA and 1OC illustrate a first sealing resin44 may be formed between the first integrated circuit chip 40 and thefirst bump pads 22. The first sealing resin 44 may fix the first bumps42 and the first integrated circuit chip 40 to the first substrate 10.

Referring to FIG. 1OB, a second sealing resin 84 may be formed betweenthe second integrated circuit chip 80 and the second bump pads 62. Thesecond sealing resin 84 may fix the second bumps 82 and the secondintegrated circuit chip 80 to the second substrate 50.

Referring to FIGS. 11A to 11C, FIG. 11A a top plan view of the firstsubstrate 10, FIG. liB is a cross-sectional view of the second substrate50 which is taken along the line XI-XI′ in FIG. 11A, and FIG. 11C is across-sectional view of the first substrate 10 which is taken along theline XI-XI′ in FIG. 11. FIGS. 11A and 11C illustrate the first uppersolder balls 46 may be bonded onto first upper ball pads 20. The firstupper solder, balls 46 may be inserted into the guide rings 30 (or 30′).Each of the first upper solder balls 46 may have a diameter smaller thanan inner radius (or width) of each of the guide rings 30 (or 30′). Eachof the first upper solder balls 46 may have a diameter (and/or height)smaller than a height of each of the guide rings 30 (or 30′).

Referring to FIG. 11B, second lower solder balls 86 may be formed on thesecond lower ball pads 60 of the second substrate 50. The second lowersolder balls 86 may be electrically connected to the second integratedcircuit chip 80 by the second bumps 82, the second bump pads 63, thesecond wire 54, and the second lower ball pads 60.

FIGS. 12A and 12B are a process top plan view and a cross-sectional viewillustrating the first substrate 10 and the second substrate 50 may bebonded to each other. FIG. 12B is a cross-sectional view taken along theline XII-XII′ in FIG. 12A. FIG. 12A shows that the first substrate 10and the second substrate 50 overlap each other, and FIG. 12B shows thatsecond lower solder balls 86 are aligned with guide rings 30 (or 30′)when the first substrate 10 and the second substrate 50 are bonded toeach other.

Referring to FIGS. 12A and 12B, the guide rings 30 (or 30′) may allowthe second lower solder balls 86 and the first upper solder balls 46 tobe aligned during the bonding of the first substrate 10 and the secondsubstrate 50 to each other. The guide rings 30 (or 30′) may enhancealignment efficiency of the first substrate 10 and the second substrate50. Thus, the manufacturing method of a semiconductor package accordingto example embodiments of the inventive concepts may increase orproduction yields.

The second lower solder balls 86 may be inserted into the guide rings 30(or 30′). Each of the second lower solder balls 86 may have the samesize (or different size) as each of the first upper solder balls 46.Each of the guide rings 30 (or 30′) may have a smaller height than eachof the first upper solder balls 46 and each of the second lower solderballs 86. The first substrate 10 and the second substrate 50 maycompress the first upper solder balls 46 and the second lower solderballs 86 when they are bonded to each other. The second substrate 50 maybe compressed toward the first substrate 10 until the guide rings 30 {or30′) and a second lower photo solder resist 66 may press each other. Thefirst substrate 10 and the second substrate 50 may be spaced apart fromeach other at regular intervals by the guide rings 30 (or 30′). Theguide rings 30 (or 30′ or 30″) may serve as a spacer between the firstsubstrate 10 and the second substrate 50. Afterwards, the firstsubstrate 10 and the second substrate 50 may be treated to bond a firstupper photo solder resist 24 to the second lower photo solder resist 66.Thus, the guide rings 30 (or 30′ or 30″) may fix the first substrate 10and the second substrate 50 to each other. First substrate 10 and secondsubstrate 50 may be treated, for example, by a heating process that meltbonds the first upper photo solder resist and the second lower photosolder resist, but example embodiments are not limited thereto. Inaddition, the guide rings 30 (or 30′) may insulate the first uppersolder balls 46 and the second lower solder balls 86 between the firstsubstrate 10 and the second substrate 50. The guide rings 30 may protectthe first lower solder balls 46 and the second lower solder balls 86.

As a result, the manufacturing method of a semiconductor packageaccording to example embodiments of the inventive concepts may increaseproduction yield.

While example embodiments of the inventive concepts have beenparticularly shown and described, it will be understood by one ofordinary skill in the art that various changes in form and detail may bemade therein without departing from the spirit and scope of the claims.

1.-20. (canceled)
 21. A manufacturing method of a semiconductor package,comprising: providing a first substrate including a first pad; providinga second substrate including a second pad opposite to the first pad;forming a guide ring to surround one of the first pad and the second padon at least one of the first and second substrates; forming at least oneelectrode on one of the first pad and the second pad; and bonding thefirst substrate and the second substrate to each other to connect thefirst pad and the second pad to the electrode.
 22. The manufacturingmethod as set forth in claim 21, wherein the forming a guide ringincludes one of a dispensing, printing and photolithography process. 23.The manufacturing method as set forth in claim 21, wherein the providinga first substrate comprises: forming the first pad on the firstsubstrate; forming a first photo solder resist on the entire surface ofthe first substrate including the first pad; and removing at least partof the first photo solder resist on the first pad to expose the firstpad.
 24. The manufacturing method as set forth in claim 23, wherein theforming at least one electrode includes forming a first electrode on thefirst pad and forming a second electrode on the second pad.
 25. Themanufacturing method as set forth in claim 24, wherein the guide ringaligns one of the first electrode and the second electrode when thefirst substrate and the second substrate are bonded to each other; 26.The manufacturing method as set forth in claim 21, wherein the guidering is formed on the first photo solder resist at a circumference ofthe first pad.
 27. The manufacturing method as set forth in 26, whereinthe second substrate further includes a second photo solder resist toselectively expose the first pad.
 28. The manufacturing method as setforth in claim 27, further comprising: heating the guide ring to bebonded to the first and second photo solder resists after bonding thefirst substrate and the second substrate to each other.
 29. Themanufacturing method as set forth in claim 21, wherein the providing ofthe first substrate comprises: forming a first photo solder resist onthe first substrate; aligning the first pad on the first photo solderresist; and melt-bonding the first pad onto the first substrate.
 30. Themanufacturing method as set forth in claim 21, further comprising:forming a first integrated circuit chip on the first substrate afterforming the guide ring.